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| ESD9X3.3ST5G SERIES ESD Protection Diodes In Ultra Small SOD-923 Package The ESD9X Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space is at a premium. Specification Features: http://onsemi.com 1 PIN 1. CATHODE 2. ANODE 2 * Small Body Outline Dimensions: * * * * * * * 0.039 x 0.024 (1.0 mm x 0.60 mm) Low Body Height: 0.017 (0.43 mm) Max Stand-off Voltage: 3.3 V - 12 V Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000-4-2 Level 4 ESD Protection These are Pb-Free Devices MARKING DIAGRAM SOD-923 CASE 514AA X M XM Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic = Specific Device Code = Date Code Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260C ORDERING INFORMATION Device ESD9XxxST5G Package SOD-923 Shipping 8000/Tape & Reel Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating IEC 61000-4-2 (ESD) ESD Voltage Contact Per Human Body Model Per Machine Model PD TJ, Tstg TL Symbol Value 30 16 400 150 -55 to +150 260 Unit kV kV V mW C C For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25C Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration) DEVICE MARKING INFORMATION See specific marking information in the device marking column of the table on page 2 of this data sheet. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in. (c) Semiconductor Components Industries, LLC, 2006 October, 2006 - Rev. 1 1 Publication Order Number: ESD9X3.3ST5G/D ESD9X3.3ST5G SERIES ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT IF VF Ppk C Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF Peak Power Dissipation Max. Capacitance @VR = 0 and f = 1 MHz IPP VC VBR VRWM IR VF IT V IF I Uni-Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) IR (mA) @ VRWM Max 2.5 1.0 1.0 VBR (V) @ IT (Note 2) Min 5.0 6.2 13.5 Max IPP (A) (Note 3) VC (V) @ Max IPP (Note 3) Max 9.8 8.7 5.9 10.4 12.3 23.7 Ppk (W) (8 x 20 ms) Typ 102 107 140 Device* ESD9X3.3ST5G ESD9X5.0ST5G ESD9X12ST5G Device Marking A B C VRWM (V) Max 3.3 5.0 12 IT mA 1.0 1.0 1.0 C (pF) Typ 80 65 30 *Other voltages available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25C. 3. Surge current waveform per Figure 3. http://onsemi.com 2 ESD9X3.3ST5G SERIES TYPICAL CHARACTERISTICS BREAKDOWN VOLTAGE (VOLTS) (VZ @ IZ) 7.4 7.3 7.2 7.1 7.0 6.9 6.8 6.7 6.6 6.5 6.4 6.3 -55 + 25 TEMPERATURE (C) + 150 IR (nA) 20 18 16 14 12 10 8 6 4 2 0 -55 + 25 TEMPERATURE (C) + 150 Figure 1. Typical Breakdown Voltage versus Temperature 100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 20 40 t, TIME (ms) tP Figure 2. Typical Leakage Current versus Temperature tr PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms 60 80 Figure 3. 8 X 20 ms Pulse Waveform Figure 4. Positive 8 kV contact per IEC 6100-4-2 - ESD9X5.0ST5G Figure 5. Negative 8 kV contact per IEC 61000-4-2 - ESD9X5.0ST5G http://onsemi.com 3 ESD9X3.3ST5G SERIES PACKAGE DIMENSIONS SOD-923 CASE 514AA-01 ISSUE B D -X- -Y- E 1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b c D E HE L MILLIMETERS MIN NOM MAX 0.36 0.40 0.43 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 MIN 0.014 0.006 0.003 0.030 0.022 0.037 0.002 INCHES NOM 0.016 0.008 0.005 0.031 0.024 0.039 0.004 MAX 0.017 0.010 0.007 0.033 0.026 0.041 0.006 b 2X 0.08 (0.0032) X Y A c L HE SOLDERING FOOTPRINT* 0.90 0.40 0.30 DIMENSIONS: MILLIMETERS SOD-923 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 ESD9X3.3ST5G/D |
Price & Availability of ESD9X12ST5G
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